multilayer ceramic chip capacitors 1 of 3 creation date : november 29, 2017 (gmt) C1608X7R1H474K080AE tdk item description c1608x7r1h474kt***s applications commercial grade please refer to part no. cga3e3x7r1h474k080ae for automotive use. feature soft soft termination series c1608 [eia 0603] status production size length(l) 1.60mm +0.20,-0.10mm width(w) 0.80mm +0.15,-0.10mm thickness(t) 0.80mm +0.15,-0.10mm terminal width(b) 0.20mm min. terminal spacing(g) 0.30mm min. recommended land pattern (pa) 0.70mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pb) 0.80mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pc) 0.60mm to 0.80mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) electrical characteristics capacitance 470nf 10% rated voltage 50vdc temperature characteristic x7r(15%) dissipation factor (max.) 5% insulation resistance (min.) 1063m other soldering method wave (flow) re?ow aec-q200 no packing punched (paper)taping [180mm reel] package quantity 4000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : november 29, 2017 (gmt) C1608X7R1H474K080AE characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance C1608X7R1H474K080AE esr C1608X7R1H474K080AE capacitance C1608X7R1H474K080AE dc bias characteristic C1608X7R1H474K080AE temperature characteristic C1608X7R1H474K080AE(no bias) C1608X7R1H474K080AE(dc bias = 25v) ripple temperature rising C1608X7R1H474K080AE(100khz) C1608X7R1H474K080AE(500khz) C1608X7R1H474K080AE(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : november 29, 2017 (gmt) C1608X7R1H474K080AE associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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